568-029 FEP ENCAPSULATED SILICONE
568-029 FEP ENCAPSULATED SILICONE
Est. Ship Date21 Oct 2026
Material Teflon encapsulated Silicone core
Minimum Temperature -75°F (-59.4°C)
Maximum Temperature 400°F (204°C)
Nominal Cross Section 1/16 inch
Nominal Inside Diameter 1 1/2 inch
Nominal Outside Diameter 1 5/8 inch