568-230 FEP ENCAPSULATED SILICONE
568-230 FEP ENCAPSULATED SILICONE
Est. Ship Date23 Oct 2026
Material Teflon encapsulated Silicone core
Minimum Temperature -75°F (-59.4°C)
Maximum Temperature 400°F (204°C)
Nominal Cross Section 1/8 inch
Nominal Inside Diameter 2 1/2 inch
Nominal Outside Diameter 2 3/4 inch